The main function of the thermal interface is to eliminate or minimize the contact thermal resistance across the interfacial barrier between two mating rigid surfaces. Thermal interface materials (TIM) as paste, pads, gels, adhesives of solders are used to fulfill the gap or minimize thae contact thermal resistance between the CPU and the heat sink. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible TIM. The major challenge in TIM testing is caused by the fact that there is a significant difference between standardized test data and application-specific test results in a specific set of application conditions.
Modeling and simulating electronic packaging systems has long been a popular issue, especially when the electronic package is enclosed. One problem with this subject has to do with the identification of the complex structure with variations in the transient state. Most network simulation programs using FEM and FDM require a great deal of computing time for compute the system in a transient state; especially the model is composed of time-invariant system parameters. An approach is proposed to develop an electro-thermal model of an enclosed electronic package that takes into account time-variant parameters under the dynamic variations of the environment.